ESD Gold Finger Tape

ESD gold finger tape is made of ESD-treated polyimide film as the backing and coated with silicone adhesive single-sided.

This product is designed to solve the problem of electrostatic sensitivity of precision electronic components and research and development, the use of high-stability polyimide substrate by a special anti-static treatment process. The composite silicone pressure-sensitive adhesive layer on the surface of the substrate forms a one-sided adhesive structure, which can effectively avoid the phenomenon of static electricity accumulation.

Appearance characteristics: amber-colored translucent film material
Thickness(mm): 0.05/0.06/0.08
Standard specification: Width 500mm×roll length 33m
Adhesion strength: 25mm width peeling force 4-6N
Thermal stability: continuous temperature resistance of 260 ℃ / instantaneous temperature resistance of 280 ℃
Anti-static(Ω):10^6-9
Environmental certification: RoHS compliant

Color	Amber
Thickness(mm)	0.05/0.06/0.08
Length(m)	33
Width(mm)	500
Peeling force(N/25mm)	4-6
Temperature resitance(℃)	280
Anti-static(Ω)	10^6-9

ESD gold finger tapes are designed for electrostatic discharge problems. ESD gold finger tape is made of polyimide film and acrylic series adhesive and anti-static agent, usually used for anti-static protection of electronic equipment, integrated circuits, and other sensitive electronic components.

ESD-insulated polyimide tape has been highly loaded with conductive particles to achieve maximum static dissipation. the very low voltages during unfolding and use.

ESD Polyimide Tape (also known as Kapton Tape) acts as a mask for printed circuit boards during wave solder or solder dip process, to protect specific areas of the PCB where ESD electrostatic discharge is a concern

Polyimide film, anti-static ESD treated, single coated with silicone adhesive Fully protects PCB gold finger contacts during the wave solder or hot air leveling process, and in applications where electrostatic discharge ESD is a concern

ESD Gold Finger Tape Features:

Low electrostatic discharge during unwinding and removal.
High-temperature resistance up to 260°C.
Excellent tensile strength and elongation.
High abrasion resistance, no adhesive residue, corrosion resistance, resistance to acids, alkalis, solvents, and other chemicals.
RoHS compliant.

ESD Gold Finger Tape Applications:

PCB Manufacturing: Wave soldering masking/hot air leveling protection/chemical gold plating process masking.
Semiconductor packaging: wafer cutting temporary fixation / chip packaging anti-static isolation.
End product applications: display module FPC temporary protection / precision connector transportation protection.
Maintenance operations: BGA rework local masking / SMT component replacement static protection.